Technical Specifications
Product Overview
Advanced 3D Subsurface Engraving
This laser processing equipment integrates advanced optics, precision mechanics, and computer-controlled systems to engrave intricate 3D patterns inside transparent crystal and glass. Utilizing a non-touch laser process, it ensures the material surface remains perfectly intact while creating high-resolution, crystal-clear imagery. Designed for high reliability and continuous operation, this machine is ideal for producing personalized gifts, decorative items, and high-precision glass art.
Performance Metrics
Engraving Speed
6,000 dots/min
Max Speed
4,000 dots/min
Min Speed
Laser Specifications
| Parameter | Value |
|---|---|
| Laser Medium | Xe lamp pumped |
| Laser Power | 3 W |
| Pulse Width | 12 ns |
| Beam Quality (M2) | < 15 |
Operational Capabilities
Precision & Accuracy
- Positioning Accuracy: 0.005 mm
- Focus Diameter: 0.06 mm
- Effective Engraving Area
- 250 x 250 x 80 mm
- Supported Graphic Formats
- DXFBMP
System Requirements
- Working Power
- AC380V±10%/50-60Hz or AC220V±10%/50-60Hz
- Operating Temperature
- 35 °C
Physical Dimensions
- Outline Dimensions
- 900 x 770 x 1400 mm
- Weight
- 330 kg
