Multilayer Printed Circuit Board with Red Soldermask
This is a multilayer printed circuit board designed for prototyping. It features a red soldermask and includes connectors, resistors, capacitors, and integrated circuits.



Technical Specifications
Overview
High-Performance 8-Layer PCB
This 8-layer multilayer printed circuit board is engineered for demanding prototyping and fabrication projects. Featuring a robust FR4 TG170 substrate and a distinctive red soldermask, it offers excellent thermal stability and visual clarity for complex circuit designs. With precision manufacturing standards including ENIG surface finish and fine-line capability, this board is an ideal choice for engineers and manufacturers requiring reliable, high-density connectivity.
Physical Specifications
Soldermask Color
- Layer Count
- 8
- Board Thickness
- 1.6 mm
Material & Finish
- Base Material
- FR4 TG170
- Surface Finish
- ENIG
- Finish Copper
- 35/35μm
Manufacturing Capabilities
- Min Width/Space
- 0.075mm / 0.075mm
- Finish Hole Size
- 0.25 mm
Application Features
- Supported Interfaces
- 30-pin40-pin50-pin


