Automatic Laser Cutting and Marking Machine

This automatic laser cutting and marking machine is applicable for high-speed cutting and marking of materials. It is designed for precision cutting and marking of various materials.

Automatic laser cutting and marking machine - Image 1

Technical Specifications

Overview

High-Precision Automated Laser Solution

This automatic laser cutting and marking machine is engineered for high-speed, precision processing of mobile phone film switches and similar materials. Featuring an advanced CO2 laser system and automated material handling, it supports 24-hour continuous operation with minimal manual intervention. The unit integrates a robust cooling system and high-precision servo motors to ensure consistent quality and efficiency in industrial environments.

Core Specifications

Laser Performance

30 W
Laser Power (Standard)
1,064 nm
Wavelength
0.01 mm
Marking Precision

Laser Technology
USA Imported CO2 laser (water-cooling/wind-cooling)

Performance & Speed

Operational Speeds

MetricValue
Materials delivery speed≤300mm/s
Max Marking Moving Speed0-7000mm/s
Max scanning speed10000mm/s

Marking & Engraving Depth
3 mm

System & Compatibility

Compatible Software
CorelDRAWPhotoshopAutoCAD
Supported Formats
DSTPLTBMPDXF
Electricity Demand
220V ±10% 15A

Operational Features

Machine Advantages

  • 24-hour continuous automated operation
  • Automatic material delivery and collection
  • Integrated cooling system for scanning head
  • Double route wind vent system for smoke extraction
  • Drawer-style scrap recycling

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