Technical Specifications
Product Overview
High-Performance Grounding Solution
This copper-bonded ground rod utilizes a 99.95% pure copper layer molecularly bonded to a low-carbon steel core through an advanced electroplating process. Designed for durability and high conductivity, the rod provides an effective, corrosion-resistant path to earth for fault currents. It is engineered to meet rigorous national and international standards, ensuring reliability for critical electrical infrastructure.
Technical Specifications
Available Diameters
- 1/2 inch
- 5/8 inch
- 3/4 inch
- Material Composition
- 99.95% Pure copper on low-carbon steel
- Copper Layer Thickness
- 254 microns
- Compliance Standards
- UL467BS7430
Features
Key Features
High ConductivityAnti-CorrosionEasy InstallationMolecularly Bonded
Customization Options
- Threaded
- Tipped
