Technical Specifications
Product Overview
High-Performance Grinding Segment
This diamond grinding segment is engineered for professional concrete and stone polishing applications. Featuring a durable metal bond matrix with embedded industrial-grade diamonds, it ensures aggressive material removal and an extended operational lifespan. It is suitable for both wet and dry grinding, delivering consistent performance on concrete, terrazzo, and natural stone surfaces.
Technical Specifications
- Outer Diameter
- 12 inch
- Segment Height
- 12 mm
- Segment Count
- 4
Available Configurations
Grit and Bond Options
| Grit Level | Bond Type |
|---|---|
| Coarse | Soft |
| Medium | Soft |
| Fine | Soft |
| Coarse | Medium Hard |
| Medium | Medium Hard |
| Fine | Medium Hard |
Application
Grinding Method
Wet GrindingDry Grinding
- Compatible Materials
- ConcreteTerrazzoNatural Stone
