Technical Specifications
Overview
Professional SMT Reflow Solution
This SMT reflow oven is engineered for high-precision PCB soldering, featuring both top and bottom forced hot air circulation. It utilizes an intelligent PID controller to ensure balanced thermal profiles with a temperature accuracy of ±1.5°C. Designed for reliability and energy efficiency, the system includes advanced over-temperature protection and fault detection to minimize downtime in high-volume production environments.
Performance
- Temperature Accuracy
- 1.5 °C
- Room Temperature Settling Time
- 20 min
Technical Features
- Control System
- PID intelligent precision controller with fuzzy control logic
- Heating Method
- Forced hot air (top and bottom zones)
Safety & Compliance
Safety Features
- Third-party over-temperature protection
- Heaters abnormal alarm
- Multiple layers of safety insulation
- Solid relay without touch point output
- Certifications
- CECCCUL
Maintenance
Maintenance Features
- Tool-free maintenance access
- Regular maintenance reminders
- Built-in fault detection system
