Plasma Coating System for Thin Film Deposition
This plasma coating system is designed for applying thin films and coatings onto various materials. It uses plasma to deposit materials with exceptional adhesion and control over film properties.
Technical Specifications
Overview
Advanced Plasma Coating Technology
This plasma coating system is a sophisticated device designed for high-precision surface modification and thin film deposition. By utilizing a high-energy plasma jet, the system enables the targeted feeding of powders and precursors to create dense, compact coatings without the use of solvents. It is engineered for versatility, supporting both micro-layer and nano-layer applications across a wide variety of substrates.
Technical Specifications
Supported Coating Types
- Cleaning and activation of substrate
- Micro layers (Zinc, Tin, Copper, etc.)
- Nano layers
- Micro Layer Thickness
- 500 μm
- Nano Layer Thickness
- 300 nm
Process Capabilities
Core Process Metrics
1,000 °C
Plasma Jet Temperature
- Atmospheric Pressure Processing
- Yes
- Coating Characteristics
- DenseCompactSolvent-freeHigh-speed
