Diamond Cutting Blade for Electroceramics
This diamond cutting blade is designed for cutting electroceramics and electric porcelain. It delivers clean and efficient cuts with minimal material loss.
Technical Specifications
Product Overview
Precision Diamond Cutting Solution
This high-performance diamond cutting blade is specifically engineered for the demanding requirements of electroceramics and electric porcelain processing. Utilizing advanced sintering technology, it delivers fast, stable cutting with high efficiency and minimal material loss. Designed for both wet and dry applications, it offers an extended lifespan and consistent performance for professional industrial use.
Technical Specifications
Compatible Machinery
- Tile saw
- Bevel-tile saw
- Angle grinder
- Circular saw
Size Specifications
| Parameter | Value |
|---|---|
| Diameter Range | 4 inch to 32 inch |
| Specific Size Shown | 400 x 10 x 60 mm |
- Cutting Applications
- ElectroceramicsElectric PorcelainDry CuttingWet Cutting
Quality & Performance
Key Performance Metrics
100 %
QC Pass Rate
Certifications
MPASGS
- Manufacturing Technology
- Cold Press SinteredHot PressSilent Core Segment
Logistics & Service
Packaging Options
- Blister packages (<230mm)
- Skin packages (<150mm)
- White box
- Brown envelope
- Lead Time
- 3 days (in stock) / 7-15 days (out of stock)
