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IC & SENSOR PACKAGING EXPO JAPAN - TOKYO 2026
Friday, January 1, 2027 - Friday, January 1, 2027
Une fois par an
Tokyo, Japan, asia-pacific
Tokyo International Exhibition Center (Tokyo Big Sight)
3-21-1 Ariake, Koto-ku, Tokyo 135-0063 Japan
À propos de cette exposition
Le principal salon d'Asie dédié à l'IC Final Manufacturing, réunissant des équipements, matériaux et services de pointe. Équipements d'assemblage, matériaux / équipements de packaging, logiciels d'analyse/simulation pour l'IC Packaging...
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